THERMAL PAD
THERMALRIGHT ODYSSEY 2.0MM THERMAL PAD
Code:
THER002
In Stock
LKR 3,000.00
Product Details & Specifications
The Thermalright Odyssey 2.0mm thermal pad is designed for heat dissipation and features a thermal conductivity of 12.8 W/mK. It is made of a gray silica gel material and has a density of 3.1±0.2 g/cc. The pad is non-conductive and has a breakdown voltage of 9.8KV. It is available in various sizes, including 85x45mm and 120x120mm.
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Here\'s a more detailed breakdown of the specifications
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Key Features
• Thermal Conductivity: 12.8 W/mK.
• Material: Gray silica gel.
• Density: 3.1±0.2 g/cc.
• Thickness: 2.0mm.
• Size: 85x45mm and 120x120mm (or other sizes depending on the specific model).
• Electrical Conductivity: None (non-conductive).
• Breakdown Voltage: 9.8KV.
• Hardness: 30~55 Sc.
• Color: Gray. <svg></svg>
Other Information
• The pad is designed to improve heat transfer between electronic components. <svg></svg>
• It is suitable for use in various applications, including CPUs, GPUs, and other electronic devices.
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• The pad can be cut to fit specific needs.
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• It is safe to use and does not interfere with electrical components.
Shipping & Returns
- Island-wide delivery available
- Secure payment options
- Warranty included
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